학술논문

Low-global warming potential fluoroether compounds for plasma etching of SiO2 and Si3N4 layers.
Document Type
Article
Source
Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; Sep2019, Vol. 37 Issue 5, pN.PAG-N.PAG, 8p
Subject
PLASMA etching
WASTE gases
ETCHING reagents
GLOBAL warming
METHOXY group
ETHERS
Language
ISSN
07342101
Abstract
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