학술논문
Sub-Millimeter and Terahertz-Wave Packaging for Large Chip-Width MMICs.
Document Type
Article
Author
Source
IEEE Microwave & Wireless Components Letters; 6/1/2016, Vol. 26 Issue 6, p422-424, 3p
Subject
Language
ISSN
15311309
Abstract
Copyright of IEEE Microwave & Wireless Components Letters is the property of IEEE and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)