학술논문
A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD' s for the LHCb RICH Detector.
Document Type
Article
Author
Source
IEEE Transactions on Nuclear Science; Aug2006 Part 2 Of 2, Vol. 53 Issue 4, p2296-2302, 7p, 4 Diagrams
Subject
Language
ISSN
00189499
Abstract
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