학술논문
Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages.
Document Type
Article
Author
Source
Journal of Applied Polymer Science; Aug2008, Vol. 109 Issue 3, p2016-2022, 7p
Subject
Language
ISSN
00218995
Abstract
The article discusses a study which investigated the effect of molding pressure on the warpage and viscoelasticities of (Head-sink Very-thin Quad Flat Nonlead) HVQFN packages. Dynamic mechanical analysis (DMA) was used in determining the viscoelastic relaxation parameters of molding materials. The characterization of the evolution of equilibrium moduli is also analyzed.