학술논문
A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters.
Document Type
Article
Author
Source
IEEE Journal of Solid-State Circuits; Jan2015, Vol. 50 Issue 1, p258-269, 12p
Subject
Language
ISSN
00189200
Abstract
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