학술논문

Advanced semiconductors for the era of centralized E/E architectures.
Document Type
Article
Source
McKinsey Insights. 6/19/2024, pN.PAG-N.PAG. 1p.
Subject
*Semiconductor industry
Semiconductors
Driver assistance systems
Language
Abstract
The article explores the use of chiplet-based designs and fusion chips in the development of advanced electrical/electronic architectures for software-defined vehicles. These technologies offer benefits such as reduced complexity, simplified integration, and cost advantages for automotive OEMs. However, challenges related to technical complexity, redundancy requirements, and conformity requirements need to be addressed. The adoption of fusion chips and chiplet-based designs is expected to increase in the coming years, with first deployments anticipated from 2026 to 2027. The article also emphasizes the importance of standardization and ecosystem development to enable chiplet adoption and discusses the implications for players in the automotive semiconductor value chain. [Extracted from the article]

Online Access