학술논문

Electrodeposited Copper Nanocatalysts for CO 2 Electroreduction: Effect of Electrodeposition Conditions on Catalysts' Morphology and Selectivity.
Document Type
Article
Source
Energies (19961073). Aug2021, Vol. 14 Issue 16, p5012. 1p.
Subject
*CATALYSTS
*ELECTROLYTIC reduction
*CARBON dioxide
*COPPER
*CATALYST selectivity
*ELECTRICAL energy
*ELECTROPLATING
*COBALT catalysts
Language
ISSN
1996-1073
Abstract
Catalytic electroreduction of carbon dioxide represents a promising technology both to reduce CO2 emissions and to store electrical energy from discontinuous sources. In this work, electrochemical deposition of copper on to a gas-diffusion support was tested as a scalable and versatile nanosynthesis technique for the production of catalytic electrodes for CO2 electroreduction. The effect of deposition current density and additives (DAT, DTAB, PEG) on the catalysts' structure was evaluated. The selectivity of the synthesized catalysts towards the production of CO was evaluated by analyzing the gaseous products obtained using the catalysts as cathodes in electroreduction tests. Catalyst morphology was deeply influenced by the deposition additives. Copper nanospheres, hemispherical microaggregates of nanowires, and shapeless structures were electrodeposited in the presence of dodecyltrimethylammonium bromide (DTAB), 3,5-diamino-1,2,4-triazole (DAT) and polyethylene glycol (PEG), respectively. The effect of the deposition current density on catalyst morphology was also observed and it was found to be additive-specific. DTAB nanostructured electrodes showed the highest selectivity towards CO production, probably attributable to a higher specific surface area. EDX and XPS analysis disclosed the presence of residual DAT and DTAB uniformly distributed onto the catalysts structure. No significant effects of electrodeposition current density and Cu(I)/Cu(II) ratio on the selectivity towards CO were found. In particular, DTAB and DAT electrodes yielded comparable selectivity, although they were characterized by the highest and lowest Cu(I)/Cu(II) ratio, respectively. [ABSTRACT FROM AUTHOR]