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New electroless copper plating bath using sodium hypophosphite as reductant.

Document Type

Article

Author

Yuan, X L; Gao, J; Yang, Z F; Wang, Z X; Wang, Z L

Source

Surface Engineering. Jun2012, Vol. 28 Issue 5, p377-381. 5p.

Subject

Language

ISSN

0267-0844

Online Access

EBSCOHost PDF Full Text (FRIC Online Journal) Web of Science JCR 저널정보 Scopus Find it@PNU

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