학술논문
MODIFICATION OF THE Cu-ETP COPPER SURFACE LAYER WITH CHROMIUM BY PHYSICAL VAPOR DEPOSITION (PVD) AND DIFFUSION ANNEALING.
Document Type
Article
Author
Source
Subject
*PHYSICAL vapor deposition
*COPPER surfaces
*CHROMIUM
*MECHANICAL loads
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Language
ISSN
0543-5846
Abstract
In the study, an attempt was made to increase durability of copper by creating a surface layer saturated or supersaturated with chromium only in the area of the highest thermo-mechanical loads during the welding process. There was developed a two-stage technological process, consisting of: application of chrome coating of the thickness approx. 1 µm on the Cu-ETP copper surface using the PVD method, and then performing the process of its diffusion by annealing at a temperature of 950 °C in the vacuum. As a result, a diffusion CuCr layer with a thickness of approx. 20 µm was obtained, with hardness of approx. 120 HV0,01. [ABSTRACT FROM AUTHOR]