학술논문

Preparation and characterization of Cu-doped TiO2 thin films and effects on platelet adhesion.
Document Type
Article
Source
Surface & Coatings Technology. Jan2015, Vol. 261, p436-441. 6p.
Subject
*TITANIUM dioxide films
*COPPER compounds
*METAL coating
*DOPED semiconductors
*X-ray diffraction
*ATOMIC force microscopy
Language
ISSN
0257-8972
Abstract
In the present study, Cu-doped (1, 2, 5 and 10 wt.%) TiO 2 thin films were prepared on silicon wafers via sol–gel method and dip coating process. The prepared thin films were thermally treated at 450 °C for 1 h with a heating rate of 2 °C/min. The microstructures of synthesized thin films were characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), water contact angle measurement (WCA), and X-ray photoelectron spectroscopy (XPS). XRD results showed that the as-prepared thin films were mainly in anatase phase. XPS analysis indicated that Cu 2 O transformed into CuO with increasing content of copper. Such doped surfaces showed the ability of catalytic decomposition of exogenous donor S-nitroso-N-acetyl-penicillamine (SNAP) to generate nitric oxide (NO). Based on SEM and fluorescence analysis results, such films had the ability to inhibit platelet adhesion and activation with SNAP in vitro . This study suggested that the films were capable of generating physiological levels of NO in the presence of endogenous donor S-nitrosothiols (RSNO) when in contact with blood. So the films may be useful to improve the hemocompatibility of blood contact devices. [ABSTRACT FROM AUTHOR]