학술논문

Wetting and reaction between Si droplet and SiO2 substrate.
Document Type
Article
Source
Journal of Materials Science. Dec2007, Vol. 42 Issue 23, p9529-9535. 7p. 7 Color Photographs, 1 Black and White Photograph, 2 Diagrams, 1 Graph.
Subject
*WETTING
*SURFACE chemistry
*SILICON compounds
*CHEMICAL reactions
*ELECTRIC discharges
*CONTACT angle
*CHEMICAL processes
*EXCHANGE reactions
*FLUID mechanics
Language
ISSN
0022-2461
Abstract
The wetting and reaction between Si melt and SiO2 substrate were investigated as a function of the atmosphere, temperature, and degree of vacuum. The results revealed that below 2 Torr with an Ar flow, the wetting angle is finally 90°. The Si droplet was stationary at a wetting angle of 90°. Videos indicated that the droplets moved and vibrated; Above 20 Torr, the Si droplet vibrated up and down with a frequency of approximately 2 Hz, thereby changing the wetting angle. Further, the droplet remained stationary on a substrate on which grooves with a width of 100 μm and depth of 100 μm were etched with a pitch of 1 mm. The presence of grooves or dimples on the substrates facilitated the leakage of SiO gas; as a result, the Si droplet did not vibrate. A vibration model was proposed in which the SiO gas produced at the interface between the Si droplet and the substrate according to the reaction Si + SiO = 2SiO expands and leaks continuously. [ABSTRACT FROM AUTHOR]