학술논문

High-resolution x-ray diffraction for characterization and monitoring of silicon-on-insulator fabrication processes.
Document Type
Article
Source
Journal of Applied Physics. 1/1/2003, Vol. 93 Issue 1, p245. 6p. 2 Black and White Photographs, 8 Graphs.
Subject
*SILICON-on-insulator technology
*X-ray diffraction
Language
ISSN
0021-8979
Abstract
High-resolution x-ray diffraction (HRXRD) was used to monitor silicon-on-insulator (SOI) device fabrication processes. The use of HRXRD is attractive since it is nondestructive and can be applied directly to product wafers. We show the usefulness of this technique for the characterization of amorphizing implants for shallow junctions, solid phase recrystallization of implanted junctions, cobalt-silicide formation, and oxidation; all are critical processes for complementary metal oxide semiconductor device fabrication on SOI. We also found the technique applicable to multilayered SOl structures fabricated by wafer bonding, where the tilt and rotation of each SOI layer with respect to the handle substrate, allowed us to obtain independent measurements of each SOI film. [ABSTRACT FROM AUTHOR]