소장자료
| LDR | 01311nam 2200337 4500 | ||
| 001 | 0100718444▲ | ||
| 005 | 20230801143323▲ | ||
| 008 | 200131s2019 |||||||||||||||||c||eng d▲ | ||
| 020 | ▼a9781085653527▲ | ||
| 082 | 0 | ▼a621▲ | |
| 100 | 1 | ▼aLi, Chen.▲ | |
| 245 | 1 | 0 | ▼aThermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels.▼h[electronic resource] ▲ |
| 260 | ▼a[S.l.] :▼bUniversity of Michigan, ▼c2019▲ | ||
| 260 | 1 | ▼aAnn Arbor :▼bProQuest Dissertations & Theses, ▼c2019▲ | |
| 300 | ▼a136 p.▲ | ||
| 500 | ▼aSource: Dissertations Abstracts International, Volume: 81-02, Section: B.▲ | ||
| 500 | ▼aAdvisor: Pipe, Kevin Patrick.▲ | ||
| 502 | 1 | ▼aThesis (Ph.D.)--University of Michigan, 2019.▲ | |
| 506 | ▼aThis item must not be sold to any third party vendors.▲ | ||
| 506 | ▼aThis item must not be added to any third party search indexes.▲ | ||
| 650 | 4 | ▼aPackaging.▲ | |
| 650 | 4 | ▼aElectrical engineering.▲ | |
| 650 | 4 | ▼aMechanical engineering.▲ | |
| 710 | 2 | 0 | ▼aUniversity of Michigan. ▼bMechanical Engineering.▲ |
| 773 | 0 | ▼tDissertations Abstracts International, ▼g81-02B.▲ | |
| 773 | ▼tDissertation Abstract International▲ | ||
| 791 | ▼aPh.D.▲ | ||
| 792 | ▼a2019▲ | ||
| 793 | ▼aEnglish▲ | ||
| 856 | 4 | 0 | ▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T15494306▲ |
Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels.[electronic resource]
자료유형
국외eBook
서명/책임사항
Thermal Management of Electronics and Optoelectronics: From Heat Source Characterization to Heat Mitigation at the Device and Package Levels. [electronic resource]
개인저자
발행사항
[S.l.] : University of Michigan , 2019 Ann Arbor : ProQuest Dissertations & Theses , 2019
형태사항
136 p.
일반주기
Source: Dissertations Abstracts International, Volume: 81-02, Section: B.
Advisor: Pipe, Kevin Patrick.
Advisor: Pipe, Kevin Patrick.
학위논문주기
Thesis (Ph.D.)--University of Michigan, 2019.
ISBN
9781085653527
관련 인기대출 도서