학술논문

발행년
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(예 : 2010-2015)
'학술논문' 에서 검색결과 990건 | 목록 1~10
Conference
2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-5 Jul, 2022
Academic Journal
Pavlović, TAzevedo, FDe, KRiaño-Moreno, JCMaglić, MGkinopoulos, TDonnelly-Kehoe, PAPayán-Gómez, CHuang, GKantorowicz, JBirtel, MDSchönegger, PCapraro, VSantamaría-García, HYucel, MIbanez, ARathje, SWetter, EStanojević, Dvan Prooijen, JWHesse, EElbaek, CTFranc, RPavlović, ZMitkidis, PCichocka, AGelfand, MAlfano, MRoss, RMSjåstad, HNezlek, JBCislak, ALockwood, PAbts, KAgadullina, EAmodio, DMApps, MAJAruta, JJBBesharati, SBor, AChoma, BCunningham, WEjaz, WFarmer, HFindor, AGjoneska, BGualda, EHuynh, TLDImran, MAIsraelashvili, JKantorowicz-Reznichenko, EKrouwel, AKutiyski, YLaakasuo, MLamm, CLevy, JLeygue, CLin, MJMansoor, MSMarie, AMayiwar, LMazepus, HMcHugh, COlsson, AOtterbring, TPacker, DPalomäki, JPerry, APetersen, MBPuthillam, ARothmund, TSchmid, PCStadelmann, DStoica, AStoyanov, DStoyanova, KTewari, STodosijević, BTorgler, BTsakiris, MTung, HHUmbreș, RGVanags, EVlasceanu, MVonasch, AJZhang, YAbad, MAdler, EMdarhri, HAAntazo, BAy, FCBa, MEHBarbosa, SBastian, BBerg, ABiałek, MBilancini, EBogatyreva, NBoncinelli, LBooth, JEBorau, SBuchel, Ode Carvalho, CFCeladin, TCerami, CChalise, HNCheng, XCian, LCockcroft, KConway, JCórdoba-Delgado, MACrespi, CCrouzevialle, MCutler, JCypryańska, MDabrowska, JDavis, VHMinda, JPDayley, PNDelouvée, SDenkovski, ODezecache, GDhaliwal, NADiato, ADi Paolo, RDulleck, UEkmanis, JEtienne, TWFarhana, HHFarkhari, FFidanovski, KFlew, TFraser, SFrempong, RBFugelsang, JGale, JGarcía-Navarro, EBGarladinne, PGray, KGriffin, SMGronfeldt, BGruber, JHalperin, EHerzon, VHruška, MHudecek, MFCIsler, OJangard, SJørgensen, FKeudel, OKoppel, LKoverola, MKunnari, ALeota, JLermer, ELi, CLongoni, CMcCashin, DMikloušić, IMolina-Paredes, JMonroy-Fonseca, CMorales-Marente, EMoreau, DMuda, RMyer, ANash, KNitschke, JPNurse, MSde Mello, VOPalacios-Galvez, MSPan, YPapp, ZPärnamets, PParuzel-Czachura, MPerander, SPitman, MRaza, ARêgo, GGRobertson, CRodríguez-Pascual, ISaikkonen, TSalvador-Ginez, OSampaio, WMSanti, GCSchultner, DSchutte, EScott, ASkali, AStefaniak, ASternisko, AStrickland, BThomas, JPTinghög, GTraast, IJTucciarelli, RTyrala, MUngson, NDUysal, MSVan Rooy, DVästfjäll, DVieira, JBvon Sikorski, CWalker, ACWatermeyer, JWillardt, RWohl, MJAWójcik, ADWu, KYamada, YYilmaz, OYogeeswaran, KZiemer, CTZwaan, RABoggio, PSWhillans, AVan Lange, PAMPrasad, ROnderco, MO'Madagain, CNesh-Nash, TLaguna, OMKubin, EGümren, MFenwick, AErtan, ASBernstein, MJAmara, HVan Bavel, JJ
PNAS nexus. 1(3)
Conference
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-4 Jun, 2020
Academic Journal
Azevedo, FPavlovic, TRego, GGAy, FCGjoneska, BEtienne, TWRoss, RMSchonegger, PRiano-Moreno, JCCichocka, ACapraro, VCian, LLongoni, CChan, HFVan Bavel, JJSjastad, HNezlek, JBAlfano, MGelfand, MJBirtel, MDCislak, ALockwood, PLAbts, KAgadullina, EAruta, JJBBesharati, SNBor, AChoma, BLCrabtree, CDCunningham, WADe, KEjaz, WElbaek, CTFindor, AFlichtentrei, DFranc, RGruber, JGualda, EHoriuchi, YHuynh, TLDIbanez, AImran, MAIsraelashvili, JJasko, KKantorowicz, JKantorowicz-Reznichenko, EKrouwel, ALaakasuo, MLamm, CLeygue, CLin, MJMansoor, MSMarie, AMayiwar, LMazepus, HMcHugh, CMinda, JPMitkidis, POlsson, AOtterbring, TPacker, DJPerry, APetersen, MBPuthillam, ARothmund, TSantamaria-Garcia, HSchmid, PCStoyanov, DTewari, STodosijevic, BTsakiris, MTung, HHUmbres, RGVanags, EVlasceanu, MVonasch, AYucel, MZhang, YCAbad, MAdler, EAkrawi, NMdarhri, HAAmara, HAmodio, DMAntazo, BGApps, MBa, MHBarbosa, SBastian, BBerg, ABernal-Zarate, MPBernstein, MBialek, MBilancini, EBogatyreva, NBoncinelli, LBooth, JEBorau, SBuchel, OCameron, CDCarvalho, CFCeladin, TCerami, CChalise, HNCheng, XJCockcroft, KConway, JCordoba-Delgado, MACrespi, CCrouzevialle, MCutler, JCypryanska, MDabrowska, JDaniels, MADavis, VHDayley, PNDelouvee, SDenkovski, ODezecache, GDhaliwal, NADiato, ABDi Paolo, RDrosinou, MDulleck, UEkmanis, JErtan, ASFarhana, HHFarkhari, FFarmer, HFenwick, AFidanovski, KFlew, TFraser, SFrempong, RBFugelsang, JAGale, JGarcia-Navarro, EBGarladinne, PGhajjou, OGkinopoulos, TGray, KGriffin, SMGronfeldt, BGumren, MGurung, RLHalperin, EHarris, EHerzon, VHruska, MHuang, GXHudecek, MFCIsler, OJangard, SJorgensen, FJKachanoff, FKahn, JDangol, AKKeudel, OKoppel, LKoverola, MKubin, EKunnari, AKutiyski, YLaguna, OMLeota, JLermer, ELevy, JLevy, NLi, CYLong, EUMaglic, MMcCashin, DMetcalf, ALMiklousic, IEl Mimouni, SMiura, AMolina-Paredes, JMonroy-Fonseca, CMorales-Marente, EMoreau, DMuda, RMyer, ANash, KNesh-Nash, TNitschke, JPNurse, MSOhtsubo, Yde Mello, VOO'Madagain, COnderco, MPalacios-Galvez, MSPalomoki, JPan, YFPapp, ZParnamets, PParuzel-Czachura, MPavlovic, ZPayan-Gomez, CPerander, SPitman, MMPrasad, RPyrkosz-Pacyna, JRathje, SRaza, ARhee, KRobertson, CERodriguez-Pascual, ISaikkonen, TSalvador-Ginez, OSanti, GCSantiago-Tovar, NSavage, DScheffer, JASchultner, DTSchutte, EMScott, ASharma, MSharma, PSkali, AStadelmann, DStafford, CAStanojevic, DStefaniak, ASternisko, AStoica, AStoyanova, KKStrickland, BSundvall, JThomas, JPTinghog, GTorgler, BTraast, IJTucciarelli, RTyrala, MUngson, NDUysal, MSVan Lange, PAMvan Prooijen, JWvan Rooy, DVastfjall, DVerkoeijen, PVieira, JBvon Sikorski, CWalker, ACWatermeyer, JWetter, EWhillans, AWhite, KHabib, RWillardt, RWohl, MJAWojcik, ADWu, KDYamada, YYilmaz, OYogeeswaran, KZiemer, CTZwaan, RABoggio, PSSampaio, WM
Scientific data. 10(1):272
Conference
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2019 Symposium on. :1-4 May, 2019
eBook
Capraro, Valerio, author; Boggio, Paulo S., author; Böhm, Robert, author; Perc, Matjaž, author; Sjåstad, Hallgeir, author
The Social Science of the COVID-19 Pandemic : A Call to Action for Researchers, 2024.
Academic Journal
IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 56(12):1-7 Dec, 2020
Conference
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2019 Symposium on. :1-4 May, 2019
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제한된 항목
[검색어] Capraro, S.
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