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Process Innovations for Future Technology Nodes with Back-Side Power Delivery and 3D Device Stacking
Conference
Kobrinsky, M.; Silva, J. D; Mannebach, E.; Mills, S.; El Qader, M. Abd; Adebayo, O.; Radhakrishna, N. Arkali; Beasley, M.; Chawla, J.; Chugh, S.; Clinton, E.; Dasgupta, A.; Desai, U.; De Re, E.; Dewey, G.; Edwards, T.; Engel, C.; Galatage, R.; Ghani, T.; Gudmundsson, V.; Hibbeler, L.; Hicks, J.; Krist, B.; Mehandru, R.; Meric, I.; Morrow, P.; Nandi, D.; Pantuso, D.; Patel, P.; Pawashe, C.; Radosavljevic, M.; Ramamurthy, R.; Samanta, D.; Cekli, S.; Shoer, L.; Amour, A. St; Tan, L. H.; Yemenicioglu, S.; Wang, X.; Wiedemer, J. A.
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Conference
Radosavljevic, Marko; Huang, C.-Y.; Galatage, R.; Qayyum, M. F.; Wiedemer, J. A.; Clinton, E.; Bennett, D.; Ryu, H.; Thomas, N. K.; Morrow, P.; Michaelos, T.; Nahm, R.; Briggs, N.; Roy, A.; Kuo, C. C.; Atanasov, S.; Ghose, S.; Zussblatt, N.; Kumar, N.; Unluer, D.; Beasley, M.; Tan, J. M.; Tan, L. H.; Elkins, M.; Cekli, S.; Hermann, R.; Shoer, L.; El Qader, M. Abd; Desai, U.; Edwards, T.; Prasad, P.; Armstrong, J.; Ghosh, M.; Liao, Y.-A.; Kapinus, V.; Dixit, D.; Harper, M. K.; Tran, P.; Cheong, K. L.; Fatehi, A.; Oni, A. A.; Franco, N.; Krist, B. J.; Metz, M. V.; Dewey, G.; Schenker, R.; Kobrinsky, M. J.
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Academic Journal
Conference
Kobrinsky, M.; Silva, J. D; Mannebach, E.; Mills, S.; Qader, M. Abd El; Adebayo, O.; Radhakrishna, N. Arkali; Beasley, M.; Chawla, J.; Chugh, S.; Dasgupta, A.; Desai, U.; Re, E. De; Dewey, G.; Edwards, T.; Engel, C.; Gudmundsson, V.; Hicks, J.; Krist, B.; Mehandru, R.; Meric, I.; Morrow, P.; Nandi, D.; Patel, P.; Ramamurthy, R.; Samanta, D.; Shoer, L.; Amour, A. St; Tan, L. H.; Yemenicioglu, S.; Wang, X.; Ghani, T.
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Conference
Chin, Y. K.; Pey, K. L.; Singh, N.; Lu, W. J.; Lo, G. Q.; Tan, L. H.; Wang, X. C.; Zheng, H.Y.; Chan, L.
Proceedings of the 2009 12th International Symposium on Integrated Circuits Integrated Circuits, ISIC '09. Proceedings of the 2009 12th International Symposium on. :141-143 Dec, 2009
Conference
Chin, Y. K.; Pey, K. L.; Singh, N.; Lo, G. Q.; Tan, L. H.; Zhu, G.; Zhou, X.; Wang, X. C.; Zheng, H.Y.
2009 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2009 IEEE International. :1-4 Dec, 2009
Academic Journal
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 30(8):843-845 Aug, 2009
Academic Journal
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 30(2):195-197 Feb, 2009
Conference
OCEANS 2006 - Asia Pacific. :1-7 May, 2006
Conference
Malevich, P.; Andriukaitis, G.; Flory, T.; Verhoef, A. J.; Fernandez, A.; Alisauskas, S.; Pugzlys, A.; Baltuska, A.; Tan, L. H.; Chua, C. F.; Phua, P. B.
CLEO: 2013 Lasers and Electro-Optics (CLEO), 2013 Conference on. :1-2 Jun, 2013
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[AR] Tan, L. H.
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