학술논문
'학술논문'
에서 검색결과 15건 | 목록
1~10
Conference
2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-4 Mar, 2021
Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach
Academic Journal
In: Materials Research Bulletin . (Materials Research Bulletin, May 2022, 149)
Academic Journal
In: Journal of Adhesion . (Journal of Adhesion, 2022, 98(1):24-48)
Academic Journal
In: ACS Omega . (ACS Omega, 14 December 2021, 6(49):34173-34184)
Academic Journal
Sato, K.; Hayashi, N.; Norimatsu, W.; Masago, N.; Takamura, M.; Morimoto, M.; Maekawa, T.; Ito, T.; Lee, D.; Qiao, K.; Kim, J.; Nakagahara, K.; Wakabayashi, K.; Hibino, H.
In: Communications Materials . (Communications Materials, December 2021, 2(1))
Academic Journal
In: Langmuir . (Langmuir, 6 April 2021, 37(13):3982-3995)
Conference
Proceedings 2003 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2003) (Cat. No.03CH37453) Intelligent robots and systems Intelligent Robots and Systems, 2003. (IROS 2003). Proceedings. 2003 IEEE/RSJ International Conference on. 1:162-167 vol.1 2003
Conference
In: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 , 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, 19 April 2021)
Conference
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. (Proceedings - Electronic Components and Technology Conference, 2021, 2021-June:520-525)
Conference
In: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019 , 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. (2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019, March 2019)
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제한된 항목
[AR] Masago, N.
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