학술논문
'학술논문'
에서 검색결과 26건 | 목록
1~10
Conference
Wood, N.; Brooks, P.; Thomas, T.; Huelsmann, T.; Koenigsmann, T.; Liong, A.; Haarmann, P.; Cho, W.; Chan, C.; Kim, K.
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :133-136 Oct, 2020
Conference
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :235-238 Oct, 2016
Conference
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International. :83-87 Oct, 2015
Academic Journal
In: Biomass and Bioenergy . (Biomass and Bioenergy, July 2021, 150)
Conference
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International. :311-313 Oct, 2008
Conference
2006 14th IEEE International Conference on Advanced Thermal Processing of Semiconductors Advanced Thermal Processing of Semiconductors, 2006. RTP '06. 14th IEEE International Conference on. :237-242 Oct, 2006
Academic Journal
In: Biomass Conversion and Biorefinery . (Biomass Conversion and Biorefinery, 1 March 2019, 9(1):55-70)
Conference
Thomas, T.; Koenigsmann, T.; Huelsmann, T.; Michalik, F.; Brooks, P.; Chan, C.; Cho, W.; Liong, A.; Wood, N.
In: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT , International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 21 October 2020, 2020-October:150-156)
Conference
Geibel, B.; Thomas, T.; Michalik, F.; Gaida, J.; Gil-Ibáñez, B.; Huelsmann, T.; Tang, F.; Zou, Y.; Kim, K.; Brooks, P.
In: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT , International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 21 October 2020, 2020-October:137-145)
Academic Journal
Physica Status Solidi (C); May2008, Vol. 5 Issue 5, p1370-1373, 4p
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[AR] Huelsmann, T.
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