학술논문

Influence of sintering condition on microstructure development of BaTiO/sub 3/ based PTCR materials
Document Type
Conference
Source
ISAF '92: Proceedings of the Eighth IEEE International Symposium on Applications of Ferroelectrics Applications of Ferroelectrics, 1992. ISAF '92., Proceedings of the Eighth IEEE International Symposium on. :476-479 1992
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Microstructure
Temperature dependence
Temperature distribution
Conductivity
Heating
Grain size
Nitrogen
Cooling
Mass spectroscopy
Grain boundaries
Language
Abstract
The influence of sintering conditions on the microstructure development of the (Ba-Sr)TiO/sub 3/ system was studied. Experimental results show that the samples were densified at a rather low temperature without substantial grain growth. As the temperature increased, both discontinuous and continuous grain growth took place, depending mainly on the temperature range and heating rate of the sintering schedule, i.e., nucleation and grain growth processes. A good PTCR (positive temperature coefficient of resistivity) characteristic was observed for samples having a grain size of 5-10 mu m. Compared to the normal process for the (Ba-Pb)TiO/sub 3/ system, sintering in nitrogen and cooling in air produces a finer grain microstructure, resulting in decreased resistivity and an improved PTCR characteristic. SIMS (secondary ion mass spectrometry) and EPMA (electron-probe microanalysis) indicated that the additive ions are mainly deposited at grain boundary and intragranular regions.ETX