학술논문
Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity
Document Type
Conference
Author
Source
2024 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2024 IEEE. :1-8 Apr, 2024
Subject
Language
ISSN
2152-3630
Abstract
Embedded silicon photonics (SiPh) is promising to enable ultra-high bandwidth system-wide connectivity with vastly reduced energy consumption by integrating optics deeply within computing sockets. We present the design and characterization of a dense wavelength-division multiplexing (DWDM) SiPh transceiver chip, featuring a unique architecture in the multi-FSR regime and targeting a shoreline bandwidth density of 2 Tbps/mm with a sub-pJ/b energy consumption, providing a viable path toward die-to-die connectivity at scale.