학술논문
Development of Integrated Thermoelectric Sensors for Power Components
Document Type
Periodical
Source
IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(8):8162-8168 Apr, 2023
Subject
Language
ISSN
1530-437X
1558-1748
2379-9153
1558-1748
2379-9153
Abstract
Power components such as High Electron Mobility Transistors (HEMTs) are used for high power and high frequency applications. These tend to overheat and destroy their packaging and connections to the wire bondings. This paper presents planar micro-thermoelectric sensors ( $\mu $ TESs) developed to measure partial heat flow dissipated by the HEMTs to avoid the HEMTs from reaching critical temperatures. These sensors use the same active materials as well as the same fabrication process as the HEMTs, enabling them to be fabricated simultaneously for a simple integration. The HEMTs’ active layers consist in AlGaN/GaN heterostructures resulting in the formation of a 2D Electron Gas (2DEG) at the interface. Tension factors of 47 mV/(K.mm2) were obtained with these sensors and heat flows of 0.2 W to 7 W were measured.