부산대학교 도서관

In the field of dental technology, the length of ceramic pontics is limited to avoid mechanical failure. To reduce thermal-induced residual stress within the ceramic, using smaller subcomponents and subsequent bonding with silicate-based glass solder may be a favorable approach. Thus, the bending strength of zirconia compounds bonded with different silicate-based glass solders was investigated. For this purpose, rectangular specimens made of zirconia were bonded by glass solder. Parameters such as the scarf angle (45° and 90°), two different glass solders, as well as the soldering process (pressure and surface treatment) were varied. All specimens were subjected to quasi-static four-point bending tests according to DIN EN ISO 843-1. Additionally, the quality of the glass solder connection was evaluated using μCT and fractography. In the present study, zirconia compounds were sucessful bonded of zirconia compounds using silicate-based glass solder was. No significant differences in terms of bending strength were observed with respect to the different bonding parameters analyzed. The highest bending strength of 130.6 ± 50.5 MPa was achieved with a 90° scarf angle combined with ethanol treatment of the specimens before soldering and an additional application of a pressure of 2 bars in a dental pressure pot before subsequent soldering. Nevertheless, the bending strengths were highly decreased when compared to monolithic zirconia specimens (993.4 ± 125.5 MPa).