학술논문

A Holistic Methodology Toward Large-scale AI Implementation using Realistic ReRAM based ACiM from Cell to Architecture
Document Type
Conference
Source
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Measurement
Buffer layers
Nonvolatile memory
Microprocessors
Computer architecture
Voltage
Voltage control
Language
ISSN
2156-017X
Abstract
Although non-volatile memory (NVM) based analog computation-in-memory (ACiM) may be the potential of highly energy efficient AI accelerators, it has been challenging to realize the real benefit due to non-ideal characteristics of ReRAM. In this study, a scalable 256kb 1T1R array-based wafer-level holistic co-optimization was demonstrated for the improvement of ReRAM based ACiM characteristics. We developed a methodology to enhance retention properties, resulting in a 65% reduction in weight variation and a 49% improvement in relaxation. With the realistic retention results, we could achieve a 124% improvement in inference accuracy on CIFAR-10 using a holistic approach. In addition, we propose a comprehensive mitigation method for IR drop for large ReRAM arrays.