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Electroless deposition of ultrathin Co-B based barriers for Cu metallization using an innovative seeding technique

Document Type

Journal

Author

Chen, GS; Tang, YS; Chen, ST; Yang, TJ

Source

ELECTROCHEMICAL AND SOLID STATE LETTERS; 2006, 9 8, pC141-pC145, 5p.

Subject

Language

English

ISSN

10990062

Online Access

Web of Science Scopus Find it@PNU

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