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Modeling and evaluation criterion for thermocompression flip-chip bonding

Document Type

Journal

Author

McLaren, TS; Lee, YC

Source

IEEE TRANSACTIONS ON ADVANCED PACKAGING; NOV 2000, 23 4, p652-p660, 9p.

Subject

Language

English

ISSN

15213323

Online Access

Full Text (IEEE) Web of Science Scopus Find it@PNU

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