학술논문
E219 High Heat Flux Cooling for Electronic Devices by Subcooled Flow Boiling : Cooing performance of small channel / E219 サブクール流動沸騰を用いた電子デバイスの高熱流束除熱 : 小さい流路の除熱特性(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)
Document Type
Journal Article
Author
Source
Proceedings of thermal engineering conference. 2001, :553
Subject
Language
Japanese
ISSN
2433-1317
Abstract
In subcooled flow boiling of water in a horizontal rectangular channel, microbubble emission boiling occurred at high subcooling of liquid in transition boiling and the heat fluxes increased higher than the critical heat fluxes. The maximum heat flux reached 10MW/m^2 for a channel with 12mm×17mm of cross section at 40K of liquid subcooling and O.5m/s of liquid velocity. For smaller channels with 14mm×5mm, 14mm×3mm, and 14mm×1mm of cross sections, the maximum heat fluxes were 7MW/m^2 that would be more than 7 times of cooling limit of CPU or power 1C of today. Microbubble emission boiling is expected to realize the high heat flux cooling for electronic devices.