학술논문
Mechanical and microstructural properties of SnAgCu solder joints
Document Type
Author abstract
Source
Materials Science & Engineering A. March 25, 2006, Vol. 420 Issue 1-2, p55, 8 p.
Subject
Language
English
ISSN
0921-5093
Abstract
To link to full-text access for this article, visit this link: http://dx.doi.org/10.1016/j.msea.2006.01.065 Byline: Janne J. Sundelin (a), Sami T. Nurmi (b), Toivo K. Lepisto (a), Eero O. Ristolainen (b) Keywords: Lead-free; Solder; SnAgCu; Shear strength; Aging Abstract: Mechanical and microstructural properties of SnAgCu solder joints with hypoeutectic, eutectic and hypereutectic compositions were studied. Eutectic SnPb joints were used as the reference. Reflowed lap shear specimens made of FR-4 glass epoxy printed circuit boards with OSP and NiAu surface finishes were used in the tests. Mechanical properties and microstructural features of the joints were examined in the as-reflowed condition and after isothermal aging at 85[degrees]C for 1000h. Both the composition and PCB surface finish had a notable effect on the mechanical behaviour of the SnAgCu solder joints. The shear strength value of SnAgCu solder joints was mainly dependent on the size and distribution of Ag.sub.3Sn dispersions. The coarseness of the dispersions depends strongly on the amount of Ag in the solder alloy, the cooling rate after the reflow and the aging history of the solder joints. Author Affiliation: (a) Institute of Materials Science, Tampere University of Technology, P.O. Box 589, FIN-33101 Tampere, Finland (b) Institute of Electronics, Tampere University of Technology, P.O. Box 692, FIN-33101 Tampere, Finland Article History: Received 1 March 2005; Revised 1 January 2006; Accepted 1 January 2006