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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Document Type

Article

Author

Olmen, J. Van; Huyghebaert, C.; Coenen, J.; Aelst, J. Van; Sleeckx, E.; Ammel, A. Van; Armini, S.; Katti, G.; Vaes, J.; Dehaene, W.; Beyne, E.; Travaly, Y.

Source

In Microelectronic Engineering 2011 88(5):745-748

Subject

Language

ISSN

0167-9317

Online Access

Full Text (ScienceDirect) Web of Science JCR 저널정보 Scopus Find it@PNU

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