학술논문
Algorithm to Design Conductive Mesh for Tamperproof Envelope
Document Type
Conference Paper
Author
Source
In: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging, SIITME 2020 - Conference Proceedings , 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging, SIITME 2020 - Conference Proceedings. (2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging, SIITME 2020 - Conference Proceedings, 21 October 2020, :106-108)
Subject
Language
English