학술논문
Micro Ball Mount Process for High Performance Fan-Out Large Panel Level Packaging Back-end Process
Document Type
Conference
Source
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :65-66 Apr, 2023
Subject
Language
Abstract
The main purpose of semiconductor packaging is to protect the chip and electrical connections. After the evolution of time, it has evolved from the Wire bond process to the WLCSP process, and then to the Fan-out process. The size also from wafer level 8" to 12", and to the 600X600mm panel level process implement by Fan-out process.[1] Among them, the back-end process of large-size panels is limited by the influence of size and warpage, and it is more easily have the risk of broken and thinning difficulties. In this paper, a solution is proposed so that the back-end process of large-size panels can be effectively integrated with the current market and gets the best possible results. Good mass production effect. And with the development of the micro ball process, the large- size panel process can be used for substrate-like applications and shorten the process time.