학술논문

A Broadband 300 GHz Power Amplifier in a 130 nm SiGe BiCMOS Technology for Communication Applications
Document Type
Periodical
Source
IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 57(7):2024-2034 Jul, 2022
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Computing and Processing
Impedance
Layout
Broadband communication
Bandwidth
Integrated circuit interconnections
Impedance matching
Transformers
6G
communications
power amplifier (PA)
SiGe interconnection bipolar transistor (HBT)
sub-mmWave
terahertz
Language
ISSN
0018-9200
1558-173X
Abstract
A broadband three-stage pseudo-differential SiGe-interconnection bipolar transistor (HBT) power amplifier (PA) for high-speed communication at around 300 GHz is presented. The amplifier is fabricated in an experimental 130-nm SiGe BiCMOS technology with an $f_{t}/f_{\max }$ of 470/650 GHz. The use of asymmetric coupled line transformers is proposed to facilitate broadband impedance transformation with device reactance compensation at all amplifier interfaces. The amplifier achieves a maximum small-signal power gain of 23.0 dB and a $P_{\mathrm{ sat}}/{\mathrm{ OP}}_{\mathrm{ 1\,dB}}$ up to 9.7/6.7 dBm, respectively. It shows a 3-dB bandwidth of 63 GHz (239–302 GHz) in small-signal operation and 94 GHz (223–317 GHz) when saturated. The amplifier consumes about 360 mW at a 3-V supply voltage yielding a peak power-added efficiency (PAE) of 1.95% at 260 GHz.