학술논문
Sub-10-µm Coil Design for Multi-Hop Inductive Coupling Interface
Document Type
Conference
Source
2021 26th Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2021 26th Asia and South Pacific. :99-100 Jan, 2021
Subject
Language
ISSN
2153-697X
Abstract
Sub-10-µm on-chip coils are designed and prototyped for the multihop inductive coupling interface in a 40-nm CMOS. Multi-layer coils and a new receiver circuit are employed to compensate the decrease of the coupling coefficient due to the small coil size. The prototype emulates a 3D stacked module with 8 dies in a 7-nm CMOS and shows that a 0.1-pJ/bit and 41-Tb/s/mm 2 inductive coupling interface is achievable.