학술논문
Current Status of Large-Scale InP Photonic Integrated Circuits
Document Type
Periodical
Author
Kish, F. A.; Welch, D.; Nagarajan, R.; Pleumeekers, J. L.; Lal, V.; Ziari, M.; Nilsson, A.; Kato, M.; Murthy, S.; Evans, P.; Corzine, S. W.; Mitchell, M.; Samra, P.; Missey, M.; DeMars, S.; Schneider, R. P.; Reffle, M. S.; Butrie, T.; Rahn, J. T.; Van Leeuwen, M.; Stewart, J. W.; Lambert, D. J.; Muthiah, R. C.; Tsai, H.; Bostak, J. S.; Dentai, A.; Wu, K.; Sun, H.; Pavinski, D. J.; Zhang, J.; Tang, J.; McNicol, J.; Kuntz, M.; Dominic, V.; Taylor, B. D.; Salvatore, R. A.; Fisher, M.; Spannagel, A.; Strzelecka, E.; Studenkov, P.; Raburn, M.; Williams, W.; Christini, D.; Thomson, K. K.; Agashe, S. S.; Malendevich, R.; Goldfarb, G.; Melle, S.; Joyner, C.; Kaufman, M.; Grubb, S. G.
Source
IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 17(6):1470-1489 Jan, 2011
Subject
Language
ISSN
1077-260X
1558-4542
1558-4542
Abstract
In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.