부산대학교 도서관

Packaging-related degradation is the key factor affecting the long-term reliable operation of IGBT. Among them, the bonding wires are one of the weak points in power module package. Under the impact of thermal stress, cracks gradually grow on the bonding wires. Further expansion of cracks eventually leads to fracture or lift off failure of bonding wires. This article proposes an identification method for different failure modes of bonding wires. Different failure modes of bonding wires lead to different trends in the collector-kelvin emitter voltage V Ce and kelvin emitter-power emitter voltage VeE. Therefore, different failure modes can be identified by the combined monitoring of V Ce and VeE. To verify the feasibility of the proposed failure modes identification method, a power cycling test is performed.