학술논문

Generation and relaxation of free volume during the post exposure bake
Document Type
Conference
Source
Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387) Microprocesses and nanotechnology 2000 Microprocesses and Nanotechnology Conference, 2000 International. :94-95 2000
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Volume relaxation
Resists
Chemical engineering
Temperature dependence
Design optimization
Monitoring
Infrared spectra
Spectroscopy
Interferometry
Language
Abstract
Upon ultraviolet exposure chemically amplified resists generate small, catalytic amounts of acid. During the post exposure bake, this acid is used to catalyze a solubility switching reaction that allows for the eventual development of latent image. The potential exists for acid catalyst to migrate from exposed regions into unexposed regions during the post exposure baking step and, thus cause feature width spread, or loss of critical dimension control. As features decrease in size, the spread caused by acid migration becomes a proportionately larger problem. This paper describes the results of experimental investigations into the fundamental mechanisms of acid transport. A fuller understanding of these mechanisms can serve both as a guide for optimizing current resist systems and for designing next generation resists.