학술논문
Hybrid III-V laser integration on a monolithic silicon photonic platform
Document Type
Conference
Author
Bian, Yusheng; Ramachandran, Koushik; Peng, Bo; Hedrick, Brittany; Mills, Scott; Donegan, Keith; Rundquist, Armand; Vail, Ed; Karra, Vaishnavi; Yasar, Firat; Esopi, Monica; Fasano, Benjamin; Sahin, Asli; Houghton, Thomas; Nummy, Karen; Ding, Hanyi; Hirokawa, Takako; Dezfulian, Kevin; Wu, Zhuojie; Fisher, Daniel; Pape, Jim; Steffes, Jay; Medina, Louis; Roy, Subharup Gupta; Cox, Harry; Green, Bart; Lubguban, Jorge; Lee, Won Suk; Aboketaf, Abdelsalam; Rakowski, Michal; McLean, Kate; Sowinski, Zoey; Kwon, Oh-Jung; Robert, Gabrielle; Sorbara, Massimo; Krishnamurthy, Subramanian; Stricker, Andy; Cho, Jae Kyu; Melville, Ian; Riggs, Dave; Augur, Rod; Robson, Norman; Berger, Daniel; Lee, Luke; Gupta, Vikas; Yu, Anthony; Giewont, Ken; Letavic, Ted; Pellerin, John
Source
2021 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2021. :1-3 Jun, 2021
Subject
Language
Abstract
We report a hybrid flip-chip-integrated laser attach technology on a monolithic SiPh platform. Efficient laser-to-PIC butt-coupling with optical power up to 11dBm was demonstrated through a combination of precise mechanical stops and optical alignment features.