학술논문
Compact physical models for multilevel interconnect crosstalk in a gigascale SoC
Document Type
Conference
Author
Source
IEEE International [Systems-on-Chip] SOC Conference, 2003. Proceedings. SOC conference SOC Conference, 2003. Proceedings. IEEE International [Systems-on-Chip]. :199-202 2003
Subject
Language
Abstract
For the first time, compact physical models are derived for multilevel interconnect crosstalk that is induced by inter and intra-level near and far aggressors. It is shown that there is a trade-off between crosstalk and latency, and crosstalk can be prohibitively large if interconnects operate in the deep RLC region. Repeater insertion is an effective way to simultaneously lower crosstalk and increase wiring density with no significant increase in latency.