학술논문
Advanced 3-D stacked technology
Document Type
Conference
Author
Source
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :13-18 2003
Subject
Language
Abstract
Array sensors (e.g. focal plane array detectors) have densely aggregated cells to capture low energy levels that are converted into electrical signals. In hybrid assemblies, where focal plane arrays are bump-bonded to readout ICs, pixel density is being continually increased as processing and assembly technologies improve. Denser arrays, combined with extremely high frame rates (e.g. >106 frames/sec) create a formidable explosion in signal content. One approach to overcoming this issue is to move the signal processing closer to the array, minimizing the number of interconnects and the interconnect length the raw pixel signal outputs must travel prior to digitization, providing opportunity to buffer bursts (