학술논문

Formation of Shallow Junctions Using Ge-Si Heterostructures for High Mobility Channel MOSFETs
Document Type
Conference
Source
2007 International Workshop on Junction Technology Junction Technology, 2007 International Workshop on. :55-60 Jun, 2007
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
MOSFETs
Substrates
CMOS technology
Boron
Epitaxial layers
Thermal stability
Jamming
Leakage current
Temperature dependence
Silicon
Language
Abstract
Shallow junctions formed on thin Ge-on-Si heterostructures are characterized in this paper. The reverse leakage current showed a strong dependence on the Ge thickness, which is believed to be due to the different activation temperature of ions implanted in the Ge layers and in the Si substrates. Ge pMOSFETs fabricated on thin Ge layers showed more significant improvement in short channel effects (SCEs) and subthreshold swing (SS) characteristics than those on thick Ge layers. Ge pMOSFETs on thin Ge are a very promising device structure for future technology nodes because of their superior immunity to short channel effects and potential drivability due to their high mobility channel.