학술논문
Mechanical analysis of encapsulated metal interconnects under transversal load
Document Type
Conference
Source
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-8 Apr, 2014
Subject
Language
Abstract
Novel insights regarding the ability of encapsulated metal interconnections to deform due to bending are presented. Encapsulated metal interconnections are used as electric conductor or measurement system within a wide range of applications fields, e.g. biomedical, wearable, textile applications. Nevertheless the mechanical analysis remains limited to reliability investigation of these configurations while deformability is as important for application fields where, so-called disappearing electronics is the main purpose.