학술논문
Design and fabrication of a scalable high-reliability vacuum sealed package for infrared detectors
Document Type
Conference
Author
Source
2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-6 Sep, 2012
Subject
Language
Abstract
Uncooled microbolometer detectors are well suited for space applications due to their low power consumption while still exhibiting adequate performance. Furthermore, the spectral range of their response can be tuned from the mid- to the far-infrared to meet different mission requirements. INO has designed and manufactured a new reliable vacuum-sealed package suitable for the packaging of several sizes and types of microbolometer FPAs. This packaging platform can be used in different configurations to meet specific requirements. INO's 512×3 pixel uncooled microbolometer FPA was used as the platform to demonstrate the efficiency of the package design and process. NETD, NEP and pressure gauge measurements were performed on this package. Adequate vacuum inside the cavity and low outgassing were demonstrated by stable NETD and pressure gauge measurements. As expected, getter activation reduces significantly the outgassing and keeps the pressure low in the package cavity.