학술논문

EBSCO Discovery Service
발행년
-
(예 : 2010-2015)
'학술논문' 에서 검색결과 1,043건 | 목록 1~20
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(11):1968-1977 Nov, 2024
Academic Journal
佛山陶瓷 / Foshan Ceramics. 32(8):66-83
Academic Journal
Nigerian Journal of Technological Development, Vol 17, Iss 4, Pp 301-305 (2021)
Academic Journal
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 34(8):975-977 Aug, 2013
Academic Journal
In Materials Today: Proceedings 2021 47 Part 13:4059-4061
Conference
2005 6th International Conference on Electronic Packaging Technology Electronics Packaging Technology Electronic Packaging Technology, 2005 6th International Conference on. :1-5 2005
Conference
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-6 Jun, 2010
Conference
International Conference on Advanced Nanomaterials & Emerging Engineering Technologies Advanced Nanomaterials and Emerging Engineering Technologies (ICANMEET), 2013 International Conference on. :658-662 Jul, 2013
Academic Journal
Известия высших учебных заведений. Поволжский регион: Физико-математические науки, Iss 4 (2020)
Academic Journal
佛山陶瓷 / Foshan Ceramics. 28(2):14-18
Conference
Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129) Industry applications conference Industry Applications Conference, 2000. Conference Record of the 2000 IEEE. 5:3021-3027 vol.5 2000
Conference
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on. :118-124 1999
Conference
ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 2:385-390 vol. 2 2000
검색 결과 제한하기
제한된 항목
[검색어] ALSIC
발행연도 제한
-
학술DB(Database Provider)
저널명(출판물, Title)
출판사(Publisher)
자료유형(Source Type)
주제어
언어