학술논문
'학술논문'
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Academic Journal
Tribology in Industry. 40(2):274-282
Academic Journal
Dai, Shengqi ; Zhang, Yifan ; Cao, Hongshuai ; Zhang, Lan ; Wu, Shuai ; Yan, Weiqing ; Zhang, Xu ; Chen, Lin ; Liao, Bin ; Liu, Lin ; Wang, Junfeng
In Ceramics International 15 October 2024 50(20) Part A:38160-38173
Academic Journal
Journal of the Brazilian Society of Mechanical Sciences and Engineering. 44(4)
Academic Journal
Nigerian Journal of Technological Development, Vol 17, Iss 4, Pp 301-305 (2021)
Academic Journal
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 34(8):975-977 Aug, 2013
Academic Journal
In Materials Today: Proceedings 2021 47 Part 13:4059-4061
Academic Journal
In Materials Today: Proceedings 2021 44 Part 1:376-382
Academic Journal
工具技术 / Tool Engineering. 53(3):15-19
Conference
2005 6th International Conference on Electronic Packaging Technology Electronics Packaging Technology Electronic Packaging Technology, 2005 6th International Conference on. :1-5 2005
Conference
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-6 Jun, 2010
Conference
International Conference on Advanced Nanomaterials & Emerging Engineering Technologies Advanced Nanomaterials and Emerging Engineering Technologies (ICANMEET), 2013 International Conference on. :658-662 Jul, 2013
Academic Journal
K. N. Nishchev; M. I. Novopol'tsev; M. Yu. Malygin; Yu. V. Chernobrovkin; V. I. Beglov; A. F. Sigachev; V. P. Mishkin; N. V. Moiseev; E. N. Lyutova
Известия высших учебных заведений. Поволжский регион: Физико-математические науки, Iss 4 (2020)
Conference
Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129) Industry applications conference Industry Applications Conference, 2000. Conference Record of the 2000 IEEE. 5:3021-3027 vol.5 2000
Academic Journal
In Materials Today: Proceedings 2017 4(2) Part A:3043-3052
Conference
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on. :118-124 1999
Conference
ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 2:385-390 vol. 2 2000
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