학술논문
'학술논문'
에서 검색결과 124건 | 목록
1~10
Academic Journal
Narayan, J. Ashwin; Manoj, V. M.; Nerkar, Gauri; Chakravarthi, M.; Dharshini, S.; Subramonian, N.; Premachandran, M. N.; Valarmathi, R.; Kumar, R. Arun; Gomathi, R.; Surendar, K. Krisha; Hemaprabha, G.; Appunu, C.
Plant Cell Reports. 42(10):1611-1628
Conference
Mirza, Fahad; Khor, E E Jan; Lee, Fook Hong; Premachandran, C S; Yi, Wanbing; Tan, Juan Boon; Graas, Carole; Justison, Patrick
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :350-355 Jul, 2016
Conference
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :93-97 Dec, 2013
Conference
Zhang, Xiaowu; Rajoo, R.; Selvanayagam, C. S.; Premachandran, C S; Choi, W. K.; Ho, S. W.; Ong, S. W.; Xie, Ling; Pinjala, D.; Sekhar, V. N.; Kwong, D.-L.
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1657-1663 Jun, 2010
Conference
Yu, Aibin; Premachandran, C. S.; Nagarajan, Ranganathan; Kyoung, Choi Won; Trang, Lam Quynh; Kumar, Rakesh; Lim, Li Shiah; Han, Johnny He; Jie, Yap Guan; Damaruganath, Pinjala
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1669-1673 Jun, 2010
Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking
Conference
Xie, Ling; Choi, Won Kyoung; Premachandran, C. S.; Selvanayagam, Cheryl S.; Bai, Ke Wu; Zeng, Ying Zhi; Ong, Siong Chiew; Liao, Ebin; Khairyanto, Ahmad; Sekhar, V. N.; Thew, Serene
2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :279-284 May, 2011
Academic Journal
Zhang, X.; Lau, J. H.; Premachandran, C. S.; Chong, S.-C.; Wai, L. C.; Lee, V.; Chai, T. C.; Kripesh, V.; Sekhar, V. N.; Pinjala, D.; Che, F. X.
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(3):299-309 Mar, 2011
Conference
Ling Xie; Paing Myo; Ser Choong Chong; Soon Wee Ho; Wee, Justin; Premachandran, C S; Wang, Sandy; herer, Inbal; Baram, Adi
2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :731-736 Dec, 2010
Conference
Choi, Won Kyoung; Premachandran, C. S.; Xie, Ling; Ong, Siong Chiew; He, Johnny Han; Yap, Guan Jie; Yu, Aibin
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :829-833 Jun, 2010
Conference
Premachandran, C S; Choi, Seungman; Cimino, Salvatore; Tran-Quinn, Thuy; Burrell, Lloyd; Justison, Patrick
2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :5B.4-1-5B.4-5 Mar, 2018
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[검색어] Premachandran, C. S.
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