학술논문
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'학술논문'
에서 검색결과 54건 | 목록
1~20
Conference
Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1108-1113 May, 2022
Conference
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1119-1124 Jun, 2021
Conference
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1442-1447 Jun, 2020
Conference
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :617-622 Jun, 2020
Conference
Velenis, Dimitrios; De Vos, Joeri; Kim, Soon-Wook; Derakhshandeh, Jaber J.; Bex, Pieter; Capuz, Giovanni; Suhard, Samuel; Rebibis, Kenneth June; Van Huylenbroeck, Stefaan; Jan Marinissen, Erik; Phommahaxay, Alain; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Beyne, Eric
2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-6 Oct, 2019
Conference
Derakhshandeh, Jaber; La Tulipe, Douglas Charles; Capuz, Giovanni; Cherman, Vladimir; Gerets, Carine; Cochet, Tom; Shafahian, Ehsan; Preter, Inge De; Jamieson, Geraldine; Webers, Tomas; Beyne, Eric; Beyer, Gerald; Miller, Andy
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :131-132 May, 2022
Conference
Bex, Pieter; Wang, Teng; Lofrano, Melina; Cherman, Vladimir; Capuz, Giovanni; Sleeckx, Erik; Beyne, Eric
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :392-398 May, 2017
Academic Journal
Laura Susana Telenchana Durán; Nelson Giovanni Alulema Pérez; Silvia Mercedes Brito Bautista; María Fanny Capuz Mejía
Ciencia Latina Revista Científica Multidisciplinar. 7:6508-6525
Conference
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; June Rebibis, Kenneth; Miller, Andy
2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016
Conference
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :791-796 Nov, 2016
Conference
Teng Wang; Podpod, Arnita; Capuz, Giovanni; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Bex, Pieter; Dubey, Vikas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric
2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-5 Sep, 2016
Conference
Cadacio, Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Potoms, Goedele; Rebibis, Kenneth June; Beyer, Gerald; Beyne, Eric; Gal, Wilfred; Zijl, Jurrian; Kersjes, Sebastiaan; Wensink, Henk
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :843-848 May, 2016
Conference
Cadacio, Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-6 Dec, 2015
Conference
Mitsukura, Kazuyuki; Makino, Tatsuya; Hatakeyama, Keiichi; Rebibis, Kenneth June; Wang, Teng; Capuz, Giovanni; Duval, Fabrice; Detalle, Mikael; Miller, Andy; Beyne, Eric
2015 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2015 IEEE. :101-104 Nov, 2015
Conference
Gerets, Carine; Derakhshandeh, Jaber; Wang, Teng; Capuz, Giovanni; Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th. :175-179 Dec, 2014
Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
Conference
Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2014. :1-5 Sep, 2014
Conference
Wang, Teng; Silva, Jose Luis; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Rebibis, Kenneth June; Kroehnert, Steffen; Beyne, Eric
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :415-419 Dec, 2013
Conference
2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :255-259 May, 2013
Academic Journal
Aleksandrs Marinins; Sebastian Hansch; Huseyin Sar; Francois Chancerel; Negin Golshani; Hsiao-Lun Wang; Artemisia Tsiara; David Coenen; Peter Verheyen; Giovanni Capuz; Yannick De Koninck; Ozan Yilmaz; Geert Morthier; Filip Schleicher; Geraldine Jamieson; Stuart Smyth; Andrew McKee; Yoojin Ban; Marianna Pantouvaki; Douglas Charles La Tulipe; Joris Van Campenhout
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:669-678
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[검색어] Capuz, Giovanni
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