학술논문
'학술논문'
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Academic Journal
Seymour, Mathew; Roslin, Tomas; deWaard, Jeremy R; Perez, Kate HJ; D'Souza, Michelle L; Ratnasingham, Sujeevan; Ashfaq, Muhammad; Levesque-Beaudin, Valerie; Blagoev, Gergin A; Bukowski, Belén; Cale, Peter; Crosbie, Denise; Decaëns, Thibaud; deWaard, Stephanie L; Ekrem, Torbjørn; El-Ansary, Hosam O; Evouna Ondo, Fidèle; Fraser, David; Geiger, Matthias F; Hajibabaei, Mehrdad; Hallwachs, Winnie; Hanisch, Priscila E; Hausmann, Axel; Heath, Mark; Hogg, Ian D; Janzen, Daniel H; Kinnaird, Margaret; Kohn, Joshua R; Larrivée, Maxim; Lees, David C; León-Règagnon, Virginia; Liddell, Michael; Lijtmaer, Darío A; Lipinskaya, Tatsiana; Locke, Sean A; Manjunath, Ramya; Martins, Dino J; Martins, Marlúcia B; Mazumdar, Santosh; McKeown, Jaclyn TA; Anderson-Teixeria, Kristina; Miller, Scott E; Milton, Megan A; Miskie, Renee; Morinière, Jérôme; Mutanen, Marko; Naik, Suresh; Nichols, Becky; Noguera, Felipe A; Novotny, Vojtech; Penev, Lyubomir; Pentinsaari, Mikko; Quinn, Jenna; Ramsay, Leah; Rochefort, Regina; Schmidt, Stefan; Smith, M Alex; Sobel, Crystal N; Somervuo, Panu; Sones, Jayme E; Staude, Hermann S; St Jaques, Brianne; Stur, Elisabeth; Telfer, Angela C; Tubaro, Pablo L; Wardlaw, Tim J; Worcester, Robyn; Yang, Zhaofu; Young, Monica R; Zemlak, Tyler; Zakharov, Evgeny V; Zlotnick, Bradley; Ovaskainen, Otso; Hebert, Paul DN
Commun Biol. 7(1)
Conference
2023 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2023 IEEE International. :1-4 May, 2023
Conference
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1713-1718 May, 2023
Academic Journal
Heil, B; van Heule, M; Thompson, S; Kearns, T; Oberhaus, E; King, G; Daels, P; Sones, J; Dini, Pouya
Veterinary Sciences. 10(11)
Conference
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :685-690 May, 2022
Academic Journal
IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(7):6481-6488 Apr, 2023
Academic Journal
IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(24):24471-24478 Dec, 2022
Conference
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :43-44 Apr, 2023
Academic Journal
Shibata, K.; Uchiyama, A.; Onishi, A.; Machida, K.; Chakraborty, P.; Iida, S.; Konishi, T.; Sone, M.; Miyake, Y.; Ito, H.
IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(15):14769-14778 Aug, 2022
Conference
Murugesan, M.; Sone, E.; Simomura, A.; Motoyoshi, M.; Sawa, M.; Fukuda, K.; Koyanagi, M.; Fukushima, T.
2021 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2021 IEEE International. :1-4 Oct, 2021
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