학술논문

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발행년	- (예 : 2010-2015)

전체선택

Key Enabling Materials for 3DIC Fabrication and Device Performance

Academic Journal

Gallagher, M.; Anzures, E.; Bell, R.; Berry, P.; Dong, H.; Lachowski, J.; Morganelli, P.; Okada, J.; Pokhrel, R.; Prange, J.; Kozhukh, J.; VanHanehem, M.; Auger, R.; Ho, M.; Lee, Y.-H.; Kondo, M.

In: Advancing Microelectronics. (Advancing Microelectronics, March 2019, 2019(DPC):1145-1164)

Scopus Find it@PNU

Void-free copper pillar hybrid wafer bonding using a BCB based polymer adhesive and chemical mechanical polishing

Conference

Gallagher, M.; Anzures, E.; Bell, R.; Kozhukh, J.; Vanhanehem, M.; Kondo, M.

In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. (Proceedings - Electronic Components and Technology Conference, 7 August 2018, 2018-May:1479-1484)

Full Text (IEEE) Scopus Find it@PNU

Advanced Cu barrier CMP slurries: ACuPLANE™ 7000 platform

Conference

Ware, S.; Vanhanehem, M.; Jacobs, K.; Buley, T.; Cohen, J.

In: 2015 International Conference on Planarization/CMP Technology, ICPT 2015, 2015 International Conference on Planarization/CMP Technology, ICPT 2015. (2015 International Conference on Planarization/CMP Technology, ICPT 2015, 17 February 2016)

Full Text (IEEE) Scopus Find it@PNU

Controlling removal rates and selectivity in barrier slurry for CU CMP for a variety of IC designs

Conference

Bian, J.; VanHanehem, M.; Li, H.

In: Proceedings - Electrochemical Society, Proceedings of the 5th International Conference on Semiconductor Technology, ISTC 2006. (Proceedings - Electrochemical Society, 2006, PV 2006-03:543-551)

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Removal of TaN/Ta barrier with variable selectivity to copper and TEOS

Conference

Bian, J.; Quanci, J.; VanHanehem, M.

In: Materials Research Society Symposium Proceedings, Chemical-Mechanical Planarization. (Materials Research Society Symposium Proceedings, 2002, 732:60-65)

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