학술논문
'학술논문'
에서 검색결과 245건 | 목록
1~10
Conference
2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :165-166 Apr, 2024
Laguzzi, F.; Åkesson, A.; Marklund, Matti; Qian, F.; Gigante, B.; Bartz, T. M.; Bassett, J. K.; Birukov, A.; Campos, H.; Hirakawa, Y.; Imamura, F.; Jäger, S.; Lankinen, M.; Murphy, R. A.; Senn, M.; Tanaka, T.; Tintle, N.; Virtanen, J. K.; Yamagishi, K.; Allison, M.; Brouwer, I. A.; De Faire, U.; Eiriksdottir, G.; Ferrucci, L.; Forouhi, N. G.; Geleijnse, J. M.; Hodge, A. M.; Kimura, H.; Laakso, M.; Risérus, Ulf, 1967; van Westing, A. C.; Bandinelli, S.; Baylin, A.; Giles, G. G.; Gudnason, V.; Iso, H.; Lemaitre, R. N.; Ninomiya, T.; Post, W. S.; Psaty, B. M.; Salonen, J. T.; Schulze, M. B.; Tsai, M. Y.; Uusitupa, M.; Wareham, N. J.; Oh, S.-W.; Wood, A. C.; Harris, W. S.; Siscovick, D.; Mozaffarian, D.; Leander, K.
Circulation. 149(4):305-316
Conference
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :290-293 Oct, 2020
Academic Journal
Conference
Lin, Y. C.; Lee, M. W.; Tsai, M. Y.; Wang, C.; Yao, J. N.; Huang, T. J.; Hsu, H. T.; Maa, J. S.; Chang, Edward Y.
2019 14th European Microwave Integrated Circuits Conference (EuMIC) Microwave Integrated Circuits Conference (EuMIC), 2019 14th European. :68-71 Sep, 2019
Conference
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Electronic Materials and Packaging (EMAP), 2018 20th International Conference on. :1-4 Dec, 2018
Conference
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Electronic Materials and Packaging (EMAP), 2018 20th International Conference on. :1-3 Dec, 2018
Determination of strength of Si interposers using PoEF test associated with acoustic emission method
Conference
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :277-280 Oct, 2016
Conference
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016 IEEE 37th International. :1-5 Sep, 2016
Conference
2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :294-297 Apr, 2016
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제한된 항목
[AR] Tsai, M. Y.
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