학술논문
'학술논문'
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Academic Journal
In Microelectronic Engineering November 2013 111:256-260
Negative bias temperature instability characterization and lifetime evaluations of submicron pMOSFET
Conference
Wan Muhamad Hatta, S.F.; Hussin, H.; Soon, F.Y.; Wahab, Y.A.; Hadi, D.A.; Soin, N.; Zahirul Alam, A.H.M.; Nordin, A.N.
2017 IEEE Symposium on Computer Applications & Industrial Electronics (ISCAIE) Computer Applications & Industrial Electronics (ISCAIE), 2017 IEEE Symposium on. :206-211 Apr, 2017
Conference
2011 3rd Asia Symposium on Quality Electronic Design (ASQED) Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on. :272-276 Jul, 2011
Conference
ICSE '96. 1996 IEEE International Conference on Semiconductor Electronics. Proceedings Semiconductor electronics Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on. :89-92 1996
Academic Journal
In: Microelectronic Engineering . (Microelectronic Engineering, 2013, 111:256-260)
Negative bias temperature instability characterization and lifetime evaluations of submicron pMOSFET
Conference
Hatta, S.F.W.M.; Hussin, H.; Soon, F.Y.; Wahab, Y.A.; Hadi, D.A.; Soin, N.; Alam, A.H.M.Z.; Nordin, A.N.
In: ISCAIE 2017 - 2017 IEEE Symposium on Computer Applications and Industrial Electronics , ISCAIE 2017 - 2017 IEEE Symposium on Computer Applications and Industrial Electronics. (ISCAIE 2017 - 2017 IEEE Symposium on Computer Applications and Industrial Electronics, 18 October 2017, :206-211)
Conference
In: IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE . (IEEE International Conference on Semiconductor Electronics, Proceedings, ICSE, 1997, :89-92)
Burn-in Failure Analysis of 0.5µm 1MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug "Worm Holes"
Conference
Widener, E.; Tatti, S.; Schani, P.; Crown, S.; Dunnigan, B.; Moss, J.; Chan, C.M.; Hamid, N.H.; Soon, F.Y.; Fitch, J.; Deeters, E.
In: Conference Proceedings from the International Symposium for Testing and Failure Analysis , ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis. (Conference Proceedings from the International Symposium for Testing and Failure Analysis, 1996, 1996-November:159-164)
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[AR] Soon, F.Y.
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