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Process Innovations for Future Technology Nodes with Back-Side Power Delivery and 3D Device Stacking
Conference
Kobrinsky, M.; Silva, J. D; Mannebach, E.; Mills, S.; El Qader, M. Abd; Adebayo, O.; Radhakrishna, N. Arkali; Beasley, M.; Chawla, J.; Chugh, S.; Clinton, E.; Dasgupta, A.; Desai, U.; De Re, E.; Dewey, G.; Edwards, T.; Engel, C.; Galatage, R.; Ghani, T.; Gudmundsson, V.; Hibbeler, L.; Hicks, J.; Krist, B.; Mehandru, R.; Meric, I.; Morrow, P.; Nandi, D.; Pantuso, D.; Patel, P.; Pawashe, C.; Radosavljevic, M.; Ramamurthy, R.; Samanta, D.; Cekli, S.; Shoer, L.; Amour, A. St; Tan, L. H.; Yemenicioglu, S.; Wang, X.; Wiedemer, J. A.
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Conference
Kobrinsky, M.; Silva, J. D; Mannebach, E.; Mills, S.; Qader, M. Abd El; Adebayo, O.; Radhakrishna, N. Arkali; Beasley, M.; Chawla, J.; Chugh, S.; Dasgupta, A.; Desai, U.; Re, E. De; Dewey, G.; Edwards, T.; Engel, C.; Gudmundsson, V.; Hicks, J.; Krist, B.; Mehandru, R.; Meric, I.; Morrow, P.; Nandi, D.; Patel, P.; Ramamurthy, R.; Samanta, D.; Shoer, L.; Amour, A. St; Tan, L. H.; Yemenicioglu, S.; Wang, X.; Ghani, T.
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
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[AR] Silva, J. D
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