학술논문

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발행년	- (예 : 2010-2015)

Regio- and Diastereoselective Decarboxylative Allylation of N-Aryl α‑Amino Acids by Dual Photoredox/Nickel Catalysis

Academic Journal

Zheng, J.; Nopper, C.; Bibi, R.; Nikbakht, A.; Bauer, F.; Breit, B.

In: ACS Catalysis. (ACS Catalysis, 20 May 2022, 12(10):5949-5960)

Full Text (ACS) Web of Science JCR 저널정보 Scopus Find it@PNU

Extended Reliability Study of High Density PZT Capacitors: Intrinsic Lifetime Determination and Wafer Level Screening Strategy

Conference

Bouyssou, E.; Guegan, G.; Bruyere, S.; Pezzani, R.; Berneux, L.; De Morais, L.D.; Rebrasse, J.-P.; Anceau, C.; Nopper, C.

2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual Reliability physics symposium, 2007. proceedings. 45th annual. ieee international. :433-438 Apr, 2007

Full Text (IEEE) Find it@PNU

Magic spot nucleotides: Tunable target-specific chemoenzymatic synthesis

Academic Journal

Haas, T.M.; Ebensperger, P.; Eisenbeis, V.B.; Nopper, C.; Dürr, T.; Jork, N.; Steck, N.; Jessen, H.J.; Jessen-Trefzer, C.

In: Chemical Communications. (Chemical Communications, 2019, 55(37):5339-5342)

Full Text (RSC Gold) Web of Science JCR 저널정보 Scopus Find it@PNU

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias.

Conference

Sukumaran, V.; Bandyopadhyay, T.; Chen, Q.; Kumbhat, N.; Liu, F.; Pucha, R.; Sato, Y.; Watanabe, M.; Kitaoka, K.; Ono, M.; Suzuki, Y.; Karoui, C.; Nopper, C.; Swaminathan, M.; Sundaram, V.; Tummala, R.

2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p583-588, 6p

Full Text (IEEE) Find it@PNU

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Conference

Sato, Y.; Ono, M.; Swaminathan, M.; Sundaram, V.; Tummala, R.; Sitaraman, S.; Sukumaran, V.; Chou, B.; Min, J.; Karoui, C.; Dosseul, F.; Nopper, C.

In: Proceedings - Electronic Components and Technology Conference, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. (Proceedings - Electronic Components and Technology Conference, 2013, :1656-1661)

Full Text (IEEE) Scopus Find it@PNU

RF device integration on glass interposer toward 3D-IPAC packages

Conference

Karoui, C.; Dosseul, F.; Nopper, C.; Sato, Y.; Chou, B.; Sukumaran, V.; Min, J.; Ono, M.; Swaminathan, M.; Sundaram, V.; Tummala, R.

In: 46th International Symposium on Microelectronics, IMAPS 2013, 46th International Symposium on Microelectronics, IMAPS 2013. (46th International Symposium on Microelectronics, IMAPS 2013, 2013, :825-830)

Scopus Find it@PNU

Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Conference

Sridharan, V.; Min, S.; Sundaram, V.; Sukumaran, V.; Hwang, S.; Chan, H.; Liu, F.; Tummala, R.; Nopper, C.

In: Proceedings - Electronic Components and Technology Conference, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. (Proceedings - Electronic Components and Technology Conference, 2010, :530-535)

Full Text (IEEE) Scopus Find it@PNU

Through-package-via formation and metallization of glass interposers

Conference

Sukumaran, V.; Chen, Q.; Liu, F.; Kumbhat, N.; Bandyopadhyay, T.; Chan, H.; Min, S.; Sundaram, V.; Tummala, R.; Nopper, C.

In: Proceedings - Electronic Components and Technology Conference, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. (Proceedings - Electronic Components and Technology Conference, 2010, :557-563)

Full Text (IEEE) Scopus Find it@PNU

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