학술논문
'학술논문'
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Academic Journal
In Applied Thermal Engineering September 2023 232
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):585-592 Apr, 2024
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(11):2168-2176 Nov, 2019
Academic Journal
In Topology and its Applications 2001 111(3):207-215
Conference
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :228-234 Mar, 2015
Conference
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :235-239 Mar, 2015
Conference
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :833-841 2006
Conference
Suhling, J.C.; Johnson, R.W.; White, J.D.; Matthai, K.W.; Knight, R.W.; Romanczuk, C.S.; Burcham, S.W.
1994 Proceedings. 44th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1994. Proceedings., 44th. :465-473 1994
Conference
[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems Thermal Phenomena in Electronic Systems, 1992. I-THERM III, InterSociety Conference on. :206-212 1992
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[AR] Knight, R.W.
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